Changdian Technology to Raise 6.5 Billion Yuan for AI Packaging Expansion
Changdian Technology, a prominent packaging and testing firm in China, announced on September 7 its intention to raise up to 6.5 billion yuan, equivalent to approximately 968 million USD, through a private placement of shares. The funds will be utilized to enhance the company's advanced packaging capacity specifically for AI chips and to support related research and development initiatives.
The investment will focus on constructing new production lines for high-density system-in-package and wafer-level packaging tailored for AI computing chips. This expansion is a response to increasing order demands from major clients, including NVIDIA and AMD. Changdian Technology highlighted that the requirements for bandwidth and heat dissipation in packaging technology have risen significantly for AI chips, leading to the near full operation of its existing capacity.
The proposed fundraising plan is subject to approval from both the shareholders' meeting and relevant regulatory authorities before it can proceed.
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Source: KLEA News