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      Micron to Expand High Bandwidth Memory Production Capacity by Year-End

      Micron Technology has announced plans to significantly increase its high bandwidth memory (HBM) production capacity, aiming to reach approximately 100,000 wafers per month by the end of this year. This expansion represents a doubling of its output compared to last year, when production was estimated at 40,000 to 50,000 wafers monthly. The move is intended to narrow the competitive gap with industry leaders Samsung Electronics and SK Hynix, both of which have higher production capacities.

      To support this increase, Micron is ramping up procurement orders from various HBM equipment suppliers, primarily located in Taiwan and Singapore. Currently, the company is focusing on HBM3E 12-layer production, with plans to boost the share of HBM4 12-layer chips, which are expected to account for 50% of production by year-end. These HBM4 chips are set to be utilized in NVIDIA's new AI accelerator, Vera Rubin, with mass production having commenced in the second quarter of this year.

      In a recent earnings call, Micron's CEO, Sanjay Mehrotra, highlighted that the ramp-up speed for HBM4 production is approximately double that of HBM3E. Cumulative revenue from HBM4 shipments has already surpassed $1 billion. Despite Micron's growth, industry estimates indicate that Samsung and SK Hynix maintain HBM production capacities between 150,000 and 200,000 wafers per month. Additionally, Micron is planning further investments in Hiroshima, Japan, to bolster its production capabilities.

      © 2026 KLEA News. All Rights Reserved. This article is provided for informational purposes only. It is not offered or intended to be used as legal, tax, investment, financial, or other advice.

      Source: KLEA News

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