Bybit Reports $19.6 Billion in Proof-of-Reserves Following Expansion of Asset Coverage
Morgan Stanley's total Bitcoin holdings surpass 10,000 BTC for the first time, worth over $870 million
CFTC seeks to define event contracts as swaps amid prediction market fight
514,175 $HYPE (46,282,266 USD) transferred from #HyperCore to #Kinetiq...
Robinhood CEO on stock token roadmap: Covering thousands of companies and exploring private equity tokenization
156,300,000 $USDC (156,362,520 USD) transferred from Unknown Whale 1 to #Aave...
Cryptocurrency Market Financing Reaches $1.114 Billion in September 2026
400,000,000 $XRP (595,636,565 USD) unlocked at #Ripple...
Solana treasury company HSDT completes $15 million share offering, to buy more SOL or repurchase shares
ESMA proposes expanding MiCA scope to cover DeFi entry points, staking and crypto lending services
U.S. SEC Files Lawsuits Against Two Private Equity Funds for Fraudulent Practices
Ripple Unlocks 1 Billion XRP Valued at Approximately 1.49 Billion USD
Hyperliquid dev team HyperLabs address requests redemption of 3.75 million HYPE
200,000,000 $XRP (297,818,282 USD) unlocked at #Ripple...
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Spot silver falls below the $60 mark
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MetaMask exits Lido validators as it investigates security incident
300,000,000 $XRP (446,727,424 USD) unlocked at #Ripple...
MetaMask Staking Withdraws from Lido Validators Following Security Breach
Ripple Unlocks 1 Billion XRP in One Go, Worth About $1.49 Billion
MetaMask said it has identified a security incident affecting part of its
KLEA Crypto Daily: Wednesday, September 30, 2026
MetaMask: Security Incident Affects Part of Infrastructure, No Immediate Threat to Wallets...
AvengerDAO Security Marketplace Expands to 17 Firms with New Additions
100,000,000 $XRP (148,909,141 USD) unlocked at #Ripple...
Fed's Kashkari: Expects one more rate hike this year and another in 2027
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Aave Founder: Closely Monitoring MetaMask Staking Incident, Aave Markets Unaffected
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1,611 $BTC (134,647,322 USD) transferred from #Kraken to unknown wallet...
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156,300,000 $USDC (156,330,400 USD) transferred from #Aave to Unknown Whale 1...
MSCI Rule Puts Strategy at Risk, Says Bitcoin Policy Institute Paper
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Gemini 4 Is Here, and Google’s Flagship Tops All Other AI Models on Cybersecurity
Robinhood to Launch Crypto Perpetual Futures in the US
Brazil’s largest energy giant tests Cardano to fix carbon double-counting
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Crypto and TradFi Are Converging Faster Than Their Business…
Trump calls for Jerome Powell to resign from the Fed Board over the...
Standard Chartered says Ethena’s ENA could crush Bitcoin and Ethereum returns by 2028
Bitcoin Approaches Positive September Close Amid Market Dynamics
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Coinbase-Backed Base Gives Users More Control With Cobalt Upgrade
250,000,000 $USDC (250,044,375 USD) minted at USDC Treasury...
U.S. Treasury Department Sanctions Tren de Aragua ATM Network and Identifies Tron Addresses
1,000 $BTC (83,746,919 USD) transferred from Coinbase Institutional to unknown wallet...
FBI Tells Its Employees to Assume Hackers Have Their Personal Data
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Standard Chartered sees Ethena’s USDe reaching $40B, ENA hitting $2
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CFTC Submits Prediction Market Rules to White House for Review
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Google releases Gemini 4 Argon, first available to U.S. government and cyber defenders
1,333 $BTC (111,494,358 USD) transferred from unknown wallet to unknown wallet...
Micron beats Q4 estimates with $54.23B revenue and $33.42 adjusted EPS...
US stocks close mixed: MARA down 5.79%, Riot Platforms (RIOT) down 5.31%
Samsung Electro-Mechanics and Qualcomm Collaborate on Advanced Packaging Technology
Samsung Electro-Mechanics and Qualcomm are collaborating on the development of organic bridge technology for 2.1D packaging, a project that has been in progress for over a year. This innovative organic bridge technology is designed to connect multiple semiconductor chips within a single package, utilizing organic materials and substrate processes, similar to the silicon bridge technology employed by Intel in its Embedded Multi-Die Interconnect Bridge (EMIB).
In this partnership, Samsung Electro-Mechanics integrates the organic bridge into Flip Chip Ball Grid Array (FC-BGA) substrates, which feature grooves that facilitate the connection of Qualcomm chips. The companies are currently assessing the performance and reliability of this technology, with Qualcomm exploring its application for large multi-chip semiconductors intended for data centers. Qualcomm has also filed for related patents in October 2024.
The organic bridge technology aims to achieve a high density of interconnections, targeting 5 to 7 layers of redistribution layers, with line widths and spacings ranging from 1.5 to 2 microns, and vias measuring 4 to 5 microns. This results in a pattern density of 500 to 1000 connections per millimeter between chips. Samsung Electro-Mechanics is managing the manufacturing and evaluation of samples in-house while also working with external suppliers and collaborating with Samsung Electronics' wafer foundry for packaging assessments.
Source: KLEA News